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IC TECHNOLOGIES
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SMT: Surface Mount Technology
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COB: Chip-On-Board
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COG: Chip-On-Glass
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TAB: Tape Automated Bonding
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BASIC SPECS TEMPERATURE CHARACTERISTICS: TN/STN wide range -30 to +80 storage -20 to +70 operating INTERFACE / CONNECTOR METHOD: FFC Flexible Flat Cable, Zebra Strips, Heat Seal, Pins, FPC Flexible Print Circuit
BACKLIGHTING: LED (Light-Emitting Diode), EL ( Electro Luminescent), CCFL (Cold Cathode Fluorescent Lamp), FIBER OPTIC
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